Graduate Intern TechnicalBookmark This
Intel is in the midst of an exciting transformation, going beyond being a company that makes the worlds best chips to one that also delivers wonderful experiences for people.
With help from talented employees like you, we will tightly integrate hardware, software and services into compelling experiences in pursuit of our vision. This decade we will create and extend computing technology to connect and enrich the lives of every person on Earth.
This is an engineering internship for graduate engineering students, working at Intel's Chandler Campus in the Phoenix metropolitan area. In this position, you will be working on adhesions between Cu plating and dielectric build up layers in electronic packaging substrate; conducting hands on lab works and data analysis to figure out the key modulators for the adhesion; helping to provide technical guidance to substrate packaging technology development based on in-depth mechanism understandings.
Candidate must be enrolled in a graduate engineering program, pursuing a PhD in Materials Science, Chemical Engineering, Mechanical Engineering, Applied Chemistry, or a closely related field.
Research experiences on polymer materials and adhesion properties