Materials Engineering InternBookmark This
DescriptionIntel Corporation is seeking a student for a 2014 Summer internship with the Materials Technology Development (MTD) group located in Chandler, AZ. MTD innovates and qualifies a wide range of microelectronic packaging materials including epoxy encapsulants, epoxy mold compounds, solder spheres, fluxes, solder pastes, thermal interface materials, adhesives, and heat spreaders.
As a materials engineering intern in MTD, you will work in a multidisciplinary team to design and execute laboratory experimentation to demonstrate proof of concept for new packaging materials technologies. Daily responsibilities may include operating lab mixers and equipment, preparing specimens for testing, interacting with testing laboratories within Intel, and documenting activities in a lab notebook. From the data the intern is expected to identify the structure/property relationships, draw conclusions, and make recommendations for achieving the desired property improvements. This internship opportunity will provide the candidate exposure to materials and packaging technologies employed by Intel for a variety of microprocessor applications.
The candidate must be enrolled and working towards an M.S. or Ph.D. degree in Chemistry, Chemical Engineering, Materials Science, PolymerScienceor a related field. The ideal candidate will have experience and interest in working in a laboratory mixing formulations, preparing test samples, conducting materials characterization testing, and mechanical and adhesion property testing. Familiarity with design of experiments, material/polymer processing, material/polymer testing, and Microsoft Office software is preferred. Good communication skills are required. Knowledge of material characterization by DSC, TGA, RDA, and related material characterization tools is highly desired.