SPTD Process Engineering Intern (Back End)Bookmark This
Intel is in the midst of an exciting transformation, going beyond being a company that makes the worlds best chips to one that also delivers wonderful experiences for people.
With help from talented employees like you, we will tightly integrate hardware, software and services into compelling experiences in pursuit of our vision. This decade we will create and extend computing technology to connect and enrich the lives of every person on Earth.
Job Description: This is an engineering internship, for graduate engineering students, in Intel's Substrate Packaging Technology Development facility on the Chandler Campus in the Phoenix metropolitan area.
The internship could begin any time during 2014 and is designed for a duration of 3-6 months, during breaks from school.
Candidate must be enrolled in a graduate engineering program, pursuing a M.S./PhD in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Applied Chemistry, Applied Physics or a closely related field.
Must have >3.3 GPA and the permanent and unrestricted right to work in the U.S. without the need for sponsorship.
Additional desired qualifications include:Strong engineering, troubleshooting and analytical skills
Good teamwork, communications and interpersonal skills
Comfort presenting issues and solutions to multiple layers of management
Background preferred: solder alloys, reflow profile, metallurgy, flux materials, pastes.