Software Engineer - InternBookmark This
Intel is in the midst of an exciting transformation, going beyond being a company that makes the worlds best chips to one that also delivers wonderful experiences for people.
With help from talented employees like you, we will tightly integrate hardware, software and services into compelling experiences in pursuit of our vision. This decade we will create and extend computing technology to connect and enrich the lives of every person on Earth.
In this position, you will developing and applying modeling methodologies to analyze the impact of temperature and mechanical stress in the reliability and manufacturing process of microprocessors devices and evaluate trade-off options between different materials and integration scenarios. The candidate will use state of art solid mechanics, multi-scale and material constitutive models.
The candidate should be enrolled in a PhD program in Mechanical Engineering, Material Science or related disciplines.
- Graduate level courses or projects focusing on linear and nonlinear modeling of thermally induced stress/strain field in solids, development of constitutive material models, heat transfer and thermal analysis.
- The position also requires knowledge of numerical methods, FEMs and FORTRAN and/or C/C++ programming, scripting languages and UNIX OS.