Silicon Photonics Advanced Packaging Intern Summer

Position: Silicon Photonics Advanced Packaging Intern (Summer 2027) Location: Round Lake Summer 2027 Intern Global Foundries (GF) is seeking a summer 2027 intern to support the development of industry-leading electro-optical transceivers using GF's Photonix platform and advanced 2.5D and 3D co-packaged optics form factors. This hands-on role will contribute to thermal, mechanical, electrical, and optical chip-package co-design with a focus on module performance, reliability, packaging design, materials selection, and advanced chiplet integration requirements. Essential

Responsibilities include: Support Silicon Photonics advanced packaging innovation and customer design enablement by contributing to packaging design rules, product requirements, and efficient manufacturing processes with internal teams and OSAT ecosystem partners. Participate in cross-functional design reviews and use engineering analysis to help resolve technical, manufacturability, reliability, and yield concerns for new customer products. Develop and apply analysis or simulation models to evaluate package performance, manufacturability, cost, and quality, and document findings and recommendations for engineering stakeholders.

Contribute to qualification robustness and continuous improvement plans by applying consistent design processes, tracking requirements, and supporting product development from concept through production readiness. Other Responsibilities: Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. Required Qualifications: Education – Actively pursuing a Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, Photonics, Optical Engineering, Packaging Engineering or a related field through an accredited degree program during the internship.

Must have at least an overall 3.0 GPA and be in good academic standing. Language Fluency - English (Written & Verbal). Travel - Up to 10%.

Ability to work at least 40 hours per week during the internship. Preferred Qualifications: Prior related internship, research, or co-op experience in semiconductor packaging, photonics, optics, or advanced electronics. Demonstrated leadership experience through academic projects, student organizations, competitions, or prior employment.

Strong interest in leveraging AI tools and emerging technologies to enhance productivity, streamline workflows, and support effective decision-making. Project management skills and the ability to innovate and execute solutions in ambiguous environments. Strong written and verbal communication skills.

Strong planning and organizational skills. Exposure to thermal, mechanical, electrical, optical, or multiphysics simulation tools. Knowledge of semiconductor packaging, chiplets, silicon photonics, or co-packaged optics is a plus.

Expected

Salary Range: $20.00 - $40.00 The exact

Salary will be determined based on qualifications, experience and location.