Hardware Engineering Intern SoC & GPU Design
Qualcomm · Seattle, Washington, USA · $23,000–$135,000 per year
- Paid
- {Internship}
About the role
Position: Hardware Engineering Intern: SoC & GPU Design (Relocation) Qualcomm Technologies, Inc. invites a Hardware Engineering Intern to collaborate on next‑generation devices within the Interns Group. You’ll join one of several tracks—GPU Engineering, CPU Engineering, Digital Design / DV, or SoC Systems Engineering—using C, C++, Python, Verilog, System Verilog, and related tools on real projects. This 11–14 week summer program offers hands-on experience, mentorship, relocation coverage, furnished housing, and exposure to Qualcomm’s innovation culture, with This is an excellent role to take on the Hardware Engineering Intern: SoC & GPU Design (Relocation) role at QUALCOMM, Inc.
Join QUALCOMM, Inc. and contribute to our ongoing work. Take a moment to read everything above and see whether this role is right for you. This posting is for the Hardware Engineering Intern: SoC & GPU Design (Relocation) role at QUALCOMM, Inc., based in United States.